Intel i3｜8GB+256G SSD｜1T HDD｜Win 11
Can be diy assembled according toactual use.
Multi-layered protection + active defense.
Built-in indor education self-developed teaching apps and resources.
Compact chassis saves space and dissipates heat quickly.
Educational general-purpose hosting with outstanding perfor-mance and network security.
Ando cloud desktop system andlOT centralized control deepintegration, control convenient.
provides multiple interfaces for a variety of peripheral connections and data transfer needs.
Equipped with a high-performance processor that reads and writes data quickly and multitask ssmoothly.
| Physical Parameter | |
| Bahan | ABS+SGCC 0.6mm |
| Security locking hole | Support, Kensington Lock |
| Weight | TBD |
| Dimension | |
| Audio | 1*Headphone+1*Microphone |
| USB Type-A | 2*USB2.0+2*USB3.2Gen |
| USB Type-C | 1*Type-C (Option) |
| External I/O Rear | |
| VGA | 1 pcs |
| HDMI | 1 pcs |
| COM | 1 RS232 full function |
| USB Type-A | 2*USB3.2Gen1 |
| RJ45+Dual Layer USB2.0 | Standard: RJ45+Dual Layer USB2.0；Option:Dual Layer USB2.0 |
| Audio | 1*LINE_Out+1*LINE_In+1*Mic_In |
| Expansion tank | |
| PCIEX16 Slot(with carabiner) | 1(PCIe3.0×8 signal) |
| PCIEX4 Slot | 1 pcs |
| PCIEX1 Slot | 1 pcs |
| Indicated light | |
| Power Lights | 1 pcs |
| Power button | 1 pcs |
| Hardware | |
| CPU | Intel® 12/13/14代 Generation CoreTM i3/i5/i7/i9 |
| Chipset | Intel H670 |
| GPU | PCIE I/O(Option) |
| RAM | 2*DDR4 U-DIMM, 2666MHz,Dual Channel，4×288PIN DDR4 UDIMM memory slots, supports up to 128GB |
| ROM | 1*2.5-inch SSD/HDD (Option) |
| HDD | Dukungan |
| Drives | Option |
| Network Connections | |
| WIFI Standard | Support WiFi 802.11b/g/n/ac/ax (Option) |
| WIFI Frequency | 2.4G/5G (optional) |
| Networking | Colay 10/100/1000M Adaptive |
| OS | |
| System | Windows 10/11/ Linux |
| Languages | Multi-language support |
| Standard Accessories | |
| Adapter Input | AC 200~240V |
| Adapter Output | TFX 200W |
| Accreditation | |
| CE、SRRC | |
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